ac240ym

OMCL-AC200TS

OMCL-AC200TS-R3 / 100 chips, Reflex side aluminum coating
OMCL-AC200TS-C3 / 24 chips, Reflex side aluminum coating

OMCL-AC200TN-R3 / 100 chips, No metal coating
OMCL-AC200TN-C3 / 24 chips, No metal coating

商品說明

Medium and Stiffer Middle Silicon Probe (New concept chip)

New OLYMPUS OMCL-AC series cantilevers are designed for AC mode AFM in air.
OMCL-AC Series has a tetrahedral tip on the exact end of the cantilever.

SEM image of tetrahedral tip cantilever (OMCL-AC160TS-
SEM image of tetrahedral tip cantilever (OMCL-AC160TS-

Model name

Coating Metal
(Tip side / Reflex)
Total number of chips
OMCL-
AC160TS-R3
OMCL-
AC200TS-R3
Non / Al 100
OMCL-
AC160TS-C3
OMCL-
AC200TS-C3
Non / Al 24
OMCL-
AC160TN-R3
OMCL-
AC200TN-R3
Non / Non 100
OMCL-
AC160TN-C3
OMCL-
AC200TN-C3
Non / Non 24
OMCL-
AC160TS-R3
OMCL-
AC200TS-R3
OMCL-
AC160TS-C3
OMCL-
AC200TS-C3
OMCL-
AC160TN-R3
OMCL-
AC200TN-R3
OMCL-
AC160TN-C3
OMCL-
AC200TN-C3
Cantilever Shape Rectangular
Dimensions (LxWxT, µm) 160x40x3.7 200x40x3.5
Resonance frequency
(in air, kHz)
300 (±100) 150 (±50)
Spring constant
(Stiffness, N/m)
26 (typ.) 9 (typ.)
Material Silicon (n-type, 0.1 – 0.4 Ω・cm)
Tip Shape Sharpened tetrahedral, ‘Tip View’ structure
Length (µm) 14
Tip radius (nm) 7 (typ.)
Tip angle
(Front)
0 degree
(Back) 35 degree
(Side) Symmetric, Cone half-angle 9 degrees or less
Material Silicon (n-type, 0.1 – 0.4 Ω・cm)
Chip Shape Rectangular cross section, Beveled chip-shoulder
Dimensions (LxWxT, mm) 3.4×1.6×0.3
Packaging Chip configuration in the box Pre-separated chip
Storage box Plastic box with a tacky coating

Outstanding features of new Tetrahedral cantilever

Application for various sample surfaces:

The mid-range mechanical properties [resonance frequency: 150kHz, spring constant: 9 N/m (typ.)] mean that the OMCL-AC200TS-R3 is tailored to any surface from soft to hard.
The stiffer middle mechanical properties [resonance frequency: 300 kHz, spring constant: 26 N/m] means that OMCLAC160TS-R3 is redesigned for revealing sample surface precisely and gently.

Doped silicon cantilever:

The cantilever is made from silicon with a low surface resistance of 0.1 – 0.4 Ω・cm.
This means 1/20 resistance of our conventional cantilevers.

Acclaimed ‘TipView’ structure:

The probe can be easily positioned at the exact point of your interest. The probe is located at the exact end of the cantilever so that the probe apex is not obscured during optical observations.

Ideally point terminated probe:

The probe is tetrahedral, ideally point terminated. The probe apex 1 micron or more is further sharpened.

New concept chip:

The ideally parallel side-walls of the chip make tweezing easy and eliminate problems with chipping and debris.

SEM image of tetrahedral tip cantilever (OMCL-AC160TS-)

Check Scan line profile and enlarged view of the tip apex.

note

Many researchers in biology and chemistry field have interests in AC mode AFM in fluid. For measuring a soft sample like a biology cell, OMCL-TR and -RC series cantilevers are recommended rather than OMCL-AC series cantilevers. See the sample images taken by OMCL-TR400PSA- and OMCL-AC120TS-.

Tip

Below are SEM images of a Tetra tip from the front and side, and the last is a magnified view from side.

Front
Front
Side
Side
Front (probe apex)
Front (probe apex)

Tip shape : sharpened tetrahedral (tilted)
It shows good symmetry viewed from the front and is inclined viewed from the side.
Considering this geometric feature, choose the fast scan (X) direction.

Dimension of levers and chip (substrates)

design of AC160TS type2 / lever and chip
lever

New concept chip has parallel side-walls.
The ideally parallel side-walls of the chip make tweezing easy and eliminate problems with chipping and debris.

OMCL-
AC160TS-*3
OMCL-
AC200TS-*3
OMCL-
AC160TN-*3
OMCL-
AC200TN-*3
L (µm) 160(±15) 200(±20)
W (µm) 40(±2) 40(±2)
t (µm) 3.7(±0.5) 3.5(±0.6)
design of AC160TS type2 / lever and chip
design of AC160TS type2 / lever and chip

Metal coating

[Reflex coating]

Thin aluminum film with the thickness of 100nm is coated on the cantilever for reflecting light from the deflection sensor in the AFM equipment. High reflex for high S/N sensing can be expected.

Packaging

design of AC160TS type2 / lever and chip

Silicon cantilevers, model OMCL-ACxxxxx-R3, are provided with 100 pre-separated chips.

design of AC160TS type2 / lever and chip

Silicon cantilevers, model OMCL-ACxxxxx-C3, are provided with 24 pre-separated chips.

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